Book description:The latest advances in three-dimensional integrated circuit stacking technology
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:
High density through silicon stacking (TSS) technology
Practical design ecosystem for heterogeneous 3D IC products
Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
Process integration for TSV manufacturing
High-aspect-ratio silicon etch for TSV
Dielectric deposition for TSV
Barrier and seed deposition
Copper electrodeposition for TSV
Chemical mechanical polishing for TSV applications
Temporary and permanent bonding
Assembly and test aspects of TSV technology
Banqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored several books, including Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds multiple patents and awards.
Dr. Ajay Kumar is Vice President and General Manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals including several review articles. Dr. Kumar co-authored the book Extreme Ultraviolet Lithography. He holds more than 100 US patents and has won many awards for innovation and commercialization.
Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.
Keywords: 3D IC STACKING TECHNOLOGY, THREE-DIMENSIONAL INTEGRATED CIRCUIT STACKING, THREE-DIMENSIONAL, INTEGRATED CIRCUIT, STACKING, TECHNOLOGY, 3D, IC, BOOK, GUIDE, HOW TO, MATT NOWAK, QUALCOMM, DESIGN, CHALLENGES, XIAOPENG XU, SYNOPSYS, PROCESS, SEQUENCE INTEGRATION, JOHN DUKOVIC, SESH RAMASWAMI, APPLIED MATERIALS, TSV ETCH, BANQIU WU AJAY KUMAR, CHEMICAL VAPOR DEPOSITION, AJAY BHATNAGAR, NAGA RAJGOPAL, BARRIER, SEED DEPOSITION, ZHITAO CAO, ECD FILL, TOM RITZDORF, SEMITOOL, CHEMICAL, MECHANICAL POLISHING, YUCHUN WANG, WAFER THINNING, SCOTT SULLIVAN, TEMPORARY, PERMANENT BONDING, MARKUS WIPLINGER, EVG, COST OF OWNERSHIP, PAUL SIBLERUD, SESH RAMASWAMI, SEMITOOL, SEMICONDUCTOR, COMPONENTS, CHIP, LITHOGRAPHY, MCM, MODULE, TRANSISTOR, SWITCH-MODE POWER SUPPLIES SPICE SIMULATIONS AND PRACTICAL DESIGNS, SWITCHING POWER SUPPLY DESIGN, PRINTED CIRCUITS HANDBOOK, MICROCHIP FABRICATION, THE ENCYCLOPEDIA OF ELECTRONIC CIRCUITS, SECRETS OF RF CIRCUIT DESIGN, COMPLETE WIRELESS DESIGN, PRINTED CIRCUIT ASSEMBLY DESIGN, SILICON-ON-SAPPHIRE CIRCUITS AND SYSTEMS, SPICE CIRCUIT HANDBOOK, FAILURE-FREE INTEGRATED CIRCUIT PACKAGES, CHARGE PUMP CIRCUIT DESIGN, ASIC DESIGN IN THE SILICON SANDBOX, NANOSCALE CMOS VLSI CIRCUITS, ELECTRICAL SAFETY OF LOW-VOLTAGE SYSTEMS, TRANSIENTS IN ELECTRICAL SYSTEMS, LOW VOLTAGE, LOW POWER VLSI SUBSYSTEMS, ADVANCED CMOS CELL DESIGN, ARM SYNTHESIZABLE DESIGN WITH ACTEL FPGAS, SYSTEMS DESIGN USING SOCS, SWITCHMODE POWER SUPPLY HANDBOOK, LINDEN'S HANDBOOK OF BATTERIES, ELECTRONIC PACKAGING AND INTERCONNECTION HANDBOOK, IMPLEMENTING LEAD-FREE ELECTRONICS, RELIABILITY OF ROHS-COMPLIANT 2D AND 3D IC INTERCONNECTS, SEMICONDUCTOR MANUFACTURING HANDBOOK, SEMICONDUCTOR HETEROJUNCTIONS AND NANOSTRUCTURES, 9780071452281 DESIGN FOR MANUFACTURABILITY HANDBOOK, MANUFACTURING ENGINEERING HANDBOOK, HOW TO IMPLEMENT LEAN MANUFACTURING, THERMAL DEFORMATION IN MACHINE TOOLS, PROCESS ENGINEERING, PROCESS CONTROL, HANDBOOK OF PETROLEUM REFINING PROCESSES, SUSTAINABILITY IN THE PROCESS INDUSTRY, CHEMICAL PROCESS AND DESIGN HANDBOOK, HANDBOOK OF PETROCHEMICALS PRODUCTION PROCESSES, HEAT TRANSFER IN PROCESS ENGINEERING, SMART PROCESS PLANTS, PRODUCTION SYSTEMS ENGINEERING, SYSTEMS ANALYSIS FOR SUSTAINABILITY ENGINEERING, THE DISASSEMBLY LINE, ENERGY SYSTEMS ENGINEERING, STEAM TURBINES, NANO/MICROSCALE HEAT TRANSFER
