The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies
Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design.
Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs.
Coverage includes:
Technology scaling
Interconnect modeling and extraction
Signal propagation and delay analysis
Interconnect coupling noise
Global signaling
Power generation
Power distribution networks
CAD of power networks
Techniques to reduce power supply noise
Power dissipation
Synchronization theory and tradeoffs
Synchronous system characteristics
On-chip clock generation and distribution
Substrate noise in mixed-signal ICs
Techniques to reduce substrate noise
Eby G. Friedman, Ph.D., is Distinguished Professor of Electrical and Computer Engineering at University of Rochester.
Emre Salman, Ph.D., is a research assistant at High Performance VLSI/IC Design and Analysis at the University of Rochester.
Keywords: HIGH PERFORMANCE INTEGRATED CIRCUIT DESIGN, EBY G. FRIEDMAN, EMRE SALMAN, COMPONENT, MIXED-SIGNAL, SOC, DESIGN, HIGH PERFORMANCE, ICS, INTEGRATED CIRCUIT, SEAMLESS, INTERCONNECT, SYSTEM-ON-CHIP, SYNCHRONIZE, TIME, DOMAIN, FREQUENCY, CLOCK, HIGH SPEED, MATERIAL, INTERCONNECTION, POWER, DISTRIBUTION, SCALING, CMOS, DEVICE, MODELING, EXTRACTION, SIGNAL, PROPAGATION, DELAY, ANALYSIS, COUPLING, NOISE, CROSSTALK, NETWORK, GLOBAL, SIGNALING, SIGNAL, INTEGRITY, RELIABILITY, GENERATION, DISTRIBUTION, DISSIPATION, GROUND, REDUCE, SYNCHRONIZATION, TIMING, OPTIMIZATION, SUBSTRATE, THREE DIMENSIONAL, 3D, NETWORKS-ON-CHIPS, ON-CHIP, OPTICAL, CARBON, NANOTUBE, FINFET, SWITCH-MODE POWER SUPPLIES SPICE SIMULATIONS AND PRACTICAL DESIGNS, SWITCHING POWER SUPPLY DESIGN, PRINTED CIRCUITS HANDBOOK, THE ENCYCLOPEDIA OF ELECTRONIC CIRCUITS, SECRETS OF RF CIRCUIT DESIGN, COMPLETE WIRELESS DESIGN, PRINTED CIRCUIT ASSEMBLY DESIGN, SILICON-ON-SAPPHIRE CIRCUITS AND SYSTEMS, SPICE CIRCUIT HANDBOOK, FAILURE-FREE INTEGRATED CIRCUIT PACKAGES, CHARGE PUMP CIRCUIT DESIGN, ASIC DESIGN IN THE SILICON SANDBOX, NANOSCALE CMOS VLSI CIRCUITS, ELECTRICAL SAFETY OF LOW-VOLTAGE SYSTEMS, TRANSIENTS IN ELECTRICAL SYSTEMS, LOW VOLTAGE, LOW POWER VLSI SUBSYSTEMS, ADVANCED CMOS CELL DESIGN, ARM SYNTHESIZABLE DESIGN WITH ACTEL FPGAS, SYSTEMS DESIGN USING SOCS, SWITCHMODE POWER SUPPLY HANDBOOK, LINDEN'S HANDBOOK OF BATTERIES, ELECTRONIC PACKAGING AND INTERCONNECTION HANDBOOK, IMPLEMENTING LEAD-FREE ELECTRONICS, RELIABILITY OF ROHS-COMPLIANT 2D AND 3D IC INTERCONNECTS, MICROCHIP FABRICATION, 3D IC STACKING TECHNOLOGY, CMOS NANOELECTRONICS, ESSENTIAL ELEMENTS OF EMBEDDED SYSTEMS HARDWARE FOR PROGRAMMERS