Book description:

Proven processes for ensuring semiconductor device reliability

Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.

Coverage includes:

  • Basic device physics

  • Process flow for MOS manufacturing

  • Measurements useful for device reliability characterization

  • Hot carrier injection

  • Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB)

  • Negative bias temperature instability

  • Plasma-induced damage

  • Electrostatic discharge protection of integrated circuits

  • Electromigration

  • Stress migration

  • Intermetal dielectric breakdown

Zhenghao Gan is a reliability technical manager at the Semiconductor Manufacturing International Corporation (SMIC), Shanghai, China. He has extensive technical and management experience in research and development of semiconductor reliability improvement, testing/characterization, problem solving, project management, modeling, and analysis.

Waisum Wong, Ph.D., is in charge of process reliability at the Semiconductor Manufacturing International Corporation (SMIC), Shanghai, China. He has extensive experience in power device development and modeling.

Juin J. Liou, Ph.D., is the Pegasus Distinguished Professor and UCF-Analog Devices Fellow in the Department of Electrical and Computer Engineering at the University of Central Florida. He has published eight books and has been awarded more than $9 million in research contracts and grants from federal agencies, state governments, and industry leaders.

Keywords: SEMICONDUCTOR PROCESS RELIABILITY IN PRACTICE, ZHENGHAO GAN, WAISUM WONG, JUIN J. LIOU, SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION, BOOK, GUIDE, HOW TO, ELECTRONICS, PROCESS RELIABILITY, SEMICONDUCTOR, PROCESS, DESIGN, ENGINEERS, ANALYSES, ANALYSIS, QUALIFICATION, SEMICONDUCTOR DEVICE, MANUFACTURING, VERIFYING, TEST STRUCTURES, PHYSICS, THEORY, TECHNOLOGY, FEOL, GOI, HCI, NBTI, PID, ESD, BEOL, EM, SM, COPPER-LOW/K, DIELECTRIC INTEGRITY, IMPROVEMENT, PROCESS OPTIMIZATION, RELIABILITY CONTROL, DESIGN OPTIMIZATION, QUALIFICATION METHODOLOGY, STRATEGY, RELIABILITY PHENOMENA, PERFORMANCE, IEEE, COMPONENT, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY, SPIE, INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, SEMI, SEMICONDUCTOR EQUIPMENT AND MATERIALS INTERNATIONAL, BMES, BIOMEDICAL ENGINEERING SOCIETY, MRS, MATERIALS RESEARCH SOCIETY, ASME, AMERICAN SOCIETY OF MECHANICAL ENGINEERS, IET, INSTITUTE OF ENGINEERING TECHNOLOGY, AGILENT, KEITHLEY, QUALITAU, ELECTRICAL ENGINEERING, COMPUTER HARDWARE, MATERIALS ENGINEERING, MECHANICAL ENGINEERING, STANDARD HANDBOOK FOR ELECTRICAL ENGINEERS, SWITCH-MODE POWER SUPPLIES SPICE SIMULATIONS AND PRACTICAL DESIGNS, SWITCHING POWER SUPPLY DESIGN, PRINTED CIRCUITS HANDBOOK, THE ENCYCLOPEDIA OF ELECTRONIC CIRCUITS, SECRETS OF RF CIRCUIT DESIGN, COMPLETE WIRELESS DESIGN, PRINTED CIRCUIT ASSEMBLY DESIGN, SILICON-ON-SAPPHIRE CIRCUITS AND SYSTEMS, SPICE CIRCUIT HANDBOOK, FAILURE-FREE INTEGRATED CIRCUIT PACKAGES, CHARGE PUMP CIRCUIT DESIGN, ASIC DESIGN IN THE SILICON SANDBOX, NANOSCALE CMOS VLSI CIRCUITS, ELECTRICAL SAFETY OF LOW-VOLTAGE SYSTEMS, TRANSIENTS IN ELECTRICAL SYSTEMS, LOW VOLTAGE, LOW POWER VLSI SUBSYSTEMS, ADVANCED CMOS CELL DESIGN, ARM SYNTHESIZABLE DESIGN WITH ACTEL FPGAS, SYSTEMS DESIGN USING SOCS, SWITCHMODE POWER SUPPLY HANDBOOK, LINDEN'S HANDBOOK OF BATTERIES, ELECTRONIC PACKAGING AND INTERCONNECTION HANDBOOK, IMPLEMENTING LEAD-FREE ELECTRONICS, RELIABILITY OF ROHS-COMPLIANT 2D AND 3D IC INTERCONNECTS, MICROCHIP FABRICATION, 3D IC STACKING TECHNOLOGY, CMOS NANOELECTRONICS, ESSENTIAL ELEMENTS OF EMBEDDED SYSTEMS HARDWARE FOR PROGRAMMERS, HIGH PERFORMANCE INTEGRATED CIRCUIT DESIGN, POWER GENERATION HANDBOOK, POWER PLANT EQUIPMENT OPERATION GUIDE HANDBOOK OF ELECTRIC POWER CALCULATIONS, ELECTRICAL POWER SYSTEMS QUALITY, ADVANCED COPPER-GOLD WIRE-STUD INTERCONNECTION TECHNOLOGIES, THROUGH-SILICON VIAS (TSVS) FOR 3D INTEGRATION, SEMICONDUCTOR MANUFACTURING HANDBOOK, SEMICONDUCTOR HETEROJUNCTIONS AND NANOSTRUCTURES, ADVANCED NONIMAGING/ILLUMINATION OPTICS, SCHAUM'S OUTLINE OF OPTICS, PHASE-SPACE OPTICS, SCHAUM'S OUTLINE OF PREPARATORY PHYSICS, HANDBOOK OF OPTICS, CHALCOGENIDE GLASSES FOR INFRARED OPTICS, OPTOFLUIDICS, SENSORS HANDBOOK, , SENSORS AND CONTROL SYSTEMS IN MANUFACTURING, HIGH POWER LASER HANDBOOK, RELIABILITY OF ROHS-COMPLIANT 2D AND 3D IC INTERCONNECTS, OPTICAL SYSTEM DESIGN, MODERN OPTICAL ENGINEERING, OPTICAL TECHNOLOGY, BIOMEDICAL INSTRUMENTATION, PHOTONICS ESSENTIALS, OPTICAL SYSTEMS DESIGN

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