A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.
This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.
Coverage includes:
Nanotechnology and 3D integration for the semiconductor industry
TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
TSVs: mechanical, thermal, and electrical behaviors
Thin-wafer strength measurement
Wafer thinning and thin-wafer handling
Microbumping, assembly, and reliability
Microbump electromigration
Transient liquid-phase bonding: C2C, C2W, and W2W
2.5D IC integration with interposers
3D IC integration with interposers
Thermal management of 3D IC integration
3D IC packaging
John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, Industrial Technology Research Institute (ITRI), Taiwan. He has published 16 books with McGraw-Hill, including Reliability of RoHS-Compliant 2D and 3D IC Interconnects , Advanced MEMS Packaging, Electronics Manufacturing with Lead-Free Solders and Low Cost Flip Chip Technologies.
Keywords: THROUGH-SILICON VIAS (TSVS) FOR 3D INTEGRATION, JOHN LAU, BOOK, GUIDE, HOW TO, MICROELECTRONICS, NANOELECTRONICS, 3D INTEGRATION, 3D IC PACKAGING, THROUGH-SILICON VIAS, TSVS, TECHNOLOGY, 3D SI INTEGRATION, 3D IC INTEGRATION, THIN-WAFER, STRENGTH, MEASUREMENTS, HANDLING, LOW-COST MICROBUMPING, C2C, C2W, BONDING, MICROBUMPS, LOW TEMPERATURE BONDING, ELECTROMIGRATION, MICROBUMP ASSEMBLIES, MEMORY STACKING, ACTIVE TSV INTERPOSERS, PASSIVE TSV INTERPOSERS, THERMAL MANAGEMENT, 3D IC, CIS, INTEGRATION, MEMS, LED, EMBEDDED 3D HYBRID IC, OPTO-ELECTRONIC, ORGANIC SUBSTRATES, MEMORY, LOGIC, I/O, LEAD-FREE, KNOWN-GOOD DIE, KGD, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. ITRI, RELIABILITY OF ROHS-COMPLIANT 2D AND 3D IC INTERCONNECTS, ADVANCED MEMS PACKAGING, ELECTRONICS MANUFACTURING WITH LEAD-FREE SOLDERS. LOW COST FLIP CHIP TECHNOLOGIES. STANDARD HANDBOOK FOR ELECTRICAL ENGINEERS, SWITCH-MODE POWER SUPPLIES SPICE SIMULATIONS AND PRACTICAL DESIGNS, SWITCHING POWER SUPPLY DESIGN, PRINTED CIRCUITS HANDBOOK, THE ENCYCLOPEDIA OF ELECTRONIC CIRCUITS, SECRETS OF RF CIRCUIT DESIGN, COMPLETE WIRELESS DESIGN, PRINTED CIRCUIT ASSEMBLY DESIGN, SILICON-ON-SAPPHIRE CIRCUITS AND SYSTEMS, SPICE CIRCUIT HANDBOOK, FAILURE-FREE INTEGRATED CIRCUIT PACKAGES, CHARGE PUMP CIRCUIT DESIGN, ASIC DESIGN IN THE SILICON SANDBOX, NANOSCALE CMOS VLSI CIRCUITS, ELECTRICAL SAFETY OF LOW-VOLTAGE SYSTEMS, TRANSIENTS IN ELECTRICAL SYSTEMS, LOW VOLTAGE, LOW POWER VLSI SUBSYSTEMS, ADVANCED CMOS CELL DESIGN, ARM SYNTHESIZABLE DESIGN WITH ACTEL FPGAS, SYSTEMS DESIGN USING SOCS, SWITCHMODE POWER SUPPLY HANDBOOK, LINDEN'S HANDBOOK OF BATTERIES, ELECTRONIC PACKAGING AND INTERCONNECTION HANDBOOK, IMPLEMENTING LEAD-FREE ELECTRONICS, MICROCHIP FABRICATION, 3D IC STACKING TECHNOLOGY, CMOS NANOELECTRONICS, ESSENTIAL ELEMENTS OF EMBEDDED SYSTEMS HARDWARE FOR PROGRAMMERS, HIGH PERFORMANCE INTEGRATED CIRCUIT DESIGN, POWER GENERATION HANDBOOK, POWER PLANT EQUIPMENT OPERATION GUIDE HANDBOOK OF ELECTRIC POWER CALCULATIONS, ELECTRICAL POWER SYSTEMS QUALITY, ADVANCED NONIMAGING/ILLUMINATION OPTICS, SCHAUM'S OUTLINE OF OPTICS, PHASE-SPACE OPTICS, SCHAUM'S OUTLINE OF PREPARATORY PHYSICS, HANDBOOK OF OPTICS, CHALCOGENIDE GLASSES FOR INFRARED OPTICS, OPTOFLUIDICS, SENSORS HANDBOOK, , SENSORS AND CONTROL SYSTEMS IN MANUFACTURING, HIGH POWER LASER HANDBOOK, OPTICAL SYSTEM DESIGN, MODERN OPTICAL ENGINEERING, OPTICAL TECHNOLOGY, BIOMEDICAL INSTRUMENTATION, PHOTONICS ESSENTIALS, OPTICAL SYSTEMS DESIGN, SEMICONDUCTOR MANUFACTURING HANDBOOK, SEMICONDUCTOR HETEROJUNCTIONS AND NANOSTRUCTURES, MANUFACTURING ENGINEERING HANDBOOK