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CITATION

Ito, Yoshimi. Thermal Deformation in Machine Tools. US: McGraw-Hill Professional, 2010.

Thermal Deformation in Machine Tools

Authors: Yoshimi Ito

Published:  June 2010

eISBN: 9780071635189 0071635181 | ISBN: 9780071635172
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  • Contents
  • Preface
  • Abbreviations
  • Nomenclature
  • Table for Conversation
  • 1 Fundamentals in Design of Structural Body Components
  • 1.1 Necessities and Importance of Lightweighted Structure in Reduction of Thermal Deformation—Discussion Using Mathematical Models
  • 1.2 First-hand View for Lightweighted Structures with High Stiffness and Damping in Practice
  • 1.2.1 Axi-symmetrical Configuration—Portal Column (Column of Twin-Pillar Type)
  • 1.2.2 Placement and Allocation of Structural Configuration Entities
  • References
  • 2 What Is Thermal Deformation?
  • 2.1 General Behavior of Thermal Deformation
  • 2.2 Estimation of Heat Sources and Their Magnitudes
  • 2.2.1 Estimation of Heat Source Position
  • 2.2.2 Estimation of Magnitude of Heat Generation
  • 2.3 Estimation of Thermal Deformation of Machine Tools
  • 2.3.1 Estimation of Thermal Deformation in General
  • 2.3.2 Thermal Deformation Caused by Inner Heat Sources
  • 2.3.3 Thermal Deformation Caused by Both Inner and Outer Heat Sources
  • 2.4 Heat Sources Generated by Chips and Their Dissipation
  • 2.4.1 Mathematical Model of Chips
  • 2.4.2 Thermal Properties of Chips—Equivalent Thermal Conductivity and Contact Resistance
  • 2.4.3 An Example of Heat Transfer from Piled Chips to Machine Tool Structure
  • 2.4.4 Dissipation of Chips
  • 2.5 Future Perspectives in Research and Development for Heat Sources and Dissipation
  • References
  • 3 Structural Materials and Design for Preferable Thermal Stability
  • 3.1 Remedies Concerning Raw Materials for Structural Body Components
  • 3.1.1 Concrete
  • 3.1.2 Painting and Coating Materials
  • 3.1.3 New Materials
  • 3.2 Remedies Concerning Structural Configurations and Plural-Spindle Systems
  • 3.2.1 Non-Sensitive Structure
  • 3.2.2 Non-Constraint Structure
  • 3.2.3 Deformation Minimization Structure
  • 3.2.4 Plural-Spindle Systems—Twin-Spindle Configuration Including Spindle-over-Spindle Type
  • 3.3 Future Perspectives in Research and Development for Structural Configuration to Minimize Thermal Deformation
  • 3.3.1 Two-Layered Spindle with Independent Rotating Function
  • 3.3.2 Selective Modular Design for Advanced Quinaxial-Controlled MC with Turning Function
  • References
  • 4 Various Remedies for Reduction of Thermal Deformation
  • 4.1 Thermal Deformations and Effective Remedies
  • 4.2 Classification of Remedies for Reduction of Thermal Deformation
  • 4.2.1 Separation of Heat Sources
  • 4.2.2 Reduction of Generated Heat
  • 4.2.3 Equalization of Temperature Distribution
  • 4.2.4 Compensation of Thermal Deformations
  • 4.3 Innovative Remedies for Minimizing Thermal Deformation in the Near Future
  • References
  • Appendix
  • A.1 Separation of Heat Sources
  • A.2 Reduction of Generated Heat
  • A.3 Equalization of Temperature Distribution
  • A.4 Compensation of Thermal Deformations
  • A.5 Optimization of Structural Design
  • 5 Finite Element Analysis for Thermal Behavior
  • 5.1 Numerical Computation for Thermal Problems in General
  • 5.1.1 Introduction
  • 5.1.2 Finite Element Method
  • 5.1.3 Finite Differences Method
  • 5.1.4 Decision Making for the Selection of Methods
  • 5.2 Procedure for Thermal Finite Element Analysis
  • 5.2.1 Introduction
  • 5.2.2 Discretisation
  • 5.2.3 Materials
  • 5.2.4 Assembling Components to an Entire Machine Tool Model
  • 5.2.5 Boundary Conditions
  • 5.2.6 Loadcases
  • 5.2.7 Linear and Non-Linear Thermal Computation
  • 5.3 Determination of Boundary Conditions
  • 5.3.1 Introduction
  • 5.3.2 Convection Heat Transfer Coefficients
  • 5.3.3 Emission Coefficients and View Factors
  • 5.3.4 Heat Sources and Sinks
  • 5.4 Thermomechanical Simulation Process
  • 5.4.1 Introduction
  • 5.4.2 Serial Processing
  • 5.4.3 Coupled Processing
  • 5.5 Future Perspectives in Research and Development for Thermal FEA
  • References
  • 6 Engineering Computation for Thermal Behavior and Thermal Performance Test
  • 6.1 Tank Model
  • 6.2 Bond Graph Simulation to Estimate Thermal Behavior within High-Voltage and NC Controllers
  • 6.3 Thermal Performance Testing
  • References
  • Index