Quantum-Well Laser Array Packaging: Nanoscale Packaging Techniques

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Quantum-Well Laser Array Packaging: Nanoscale Packaging Techniques

Quantum-Well Laser Array Packaging: Nanoscale Packaging Techniques

Authors: Jens W. Tomm and Juan Jiménez

Published: 2007

ISBN: 9780071661645 0071460322

Contents

Contributors

Foreword

Chapter 1. Introduction Jens W.Tomm and Juan Jiménez

References

Chapter 2. Overview of Laser Diode Degradation Mechanisms Juan Jiménez, Manuel Avella, Matthieu Pommies, and Pierre Picouet

2.1 Introduction

2.2 Laser Diode Fundamentals

2.2.1 Laser structures

2.3 Screening Methods

2.3.1 Aging tests and enhancement factors

2.3.2 Screening the bars

2.3.3 Screening packaged bars

2.4 Degradation Modes

2.4.1 General description

2.4.2 Rapid degradation

2.4.3 Gradual degradation

2.4.4 Catastrophic degradation

2.4.5 Spatial location of the degradation

2.5 Characterization Techniques

2.5.1 Preview of characterization techniques

2.5.2 Light-emitting techniques

2.5.3 Micro-Raman

2.5.4 Thermoreflectance

2.5.5 Photocurrent

2.5.6 Deep-level transient spectroscopy

2.5.7 Electron-beam-induced current

2.5.8 Transmission Electron Microscopy

2.5.9 Analytic probes: AES and EDX

2.6 Device Processing

2.7 Facet Degradation

2.7.1 COD mechanism

2.7.2 Al-based lasers

2.7.3 Al-free lasers

2.8 Comparative Degradation among Different Lasers

2.8.1 InGaAsP/InGaP

2.8.2 InGaAsP/InP lasers

2.8.3 AlGaAs/GaAs

2.8.4 InGaAs/AlGaAs

2.9 External Degradation

References

Chapter 3. Strain Measurement Jean-Pierre Landesman, Daniel T. Cassidy, Jens W.Tomm, and Mark L. Biermann

3.1 General Overview of the Chapter

3.2 Theory

3.2.1 Overview of theory discussion

3.2.2 Description of a theoretical approach: Basic details

3.2.3 Quantum-confined Stark effect and excitonic effects

3.2.4 Model of packaging-induced strain

3.2.5 Intrinsic strain and the overall strain configuration

3.2.6 Piecewise linearity of transition-energy shifts with strain

3.2.7 Results of the theory

3.2.8 Comparison of theory with experiment

3.3 Polarized Photoluminescence (DOP, ROP)

3.3.1 Introduction

3.3.2 Band structure and polarization of luminescence

3.3.3 DOP and strain

3.3.4 ROP

3.3.5 Apparatus

3.3.6 Calibration constant Ce

3.3.7 Measurements on lasers

3.4 Micro-Photoluminescence (µ-PL)

3.4.1 Introduction

3.4.2 Detailed analysis of the PL line shape—experimental

3.4.3 Implementation of the µ-PL technique for the measurement of packaging-induced strain profiles

3.4.4 Some examples

3.4.5 Summary of µ-PL

3.5 Photocurrent Spectroscopy (PCS)

3.5.1 Introduction

3.5.2 Physics of photocurrent generation

3.5.3 Instrumentation for photocurrent measurements

3.5.4 Techniques related to photocurrent spectroscopy

3.5.5 Strain analysis by photocurrent spectroscopy

3.5.6 Defect analysis by photocurrent spectroscopy

3.5.7 The interplay of strain and defects

3.5.8 Summary of PCS

References

Chapter 4. Laser Facet Inspection by Imaging Techniques Stephen Bull, Eric C. Larkins, Martina Baeumler, and Juan Jiménez

4.1 Photo- and Electroluminescence Microscopy and Spectroscopically Resolved Photo- and Electroluminescence Microscopy

4.1.1 Photo- and electroluminescence microscopy

4.1.2 Spectroscopic PLM and ELM

4.2 Near-Field Observation

4.2.1 Measurement of near-field patterns and spectra of individual emitters in laser bars

4.2.2 Analysis of near-field patterns and emission spectra of individual emitters

4.2.3 Spectral analysis of emitters to determine position and scattering strength of intracavity defects

4.3 Cathodoluminescence Imaging

4.3.1 Single emitters

4.3.2 Laser bars

4.3.3 Some hypotheses about the formation of the V defects

4.3.4 Summary

4.4 Conclusions

4.4.1 PLM

4.4.2 ELM

4.4.3 CLI

4.4.4 Summary

References

Chapter 5. Failure Prediction of High-Power Laser Bars Myriam Oudart, Julien Nagle, Jens W.Tomm, Eric C. Larkins, and Stephen Bull

5.1 Introduction

5.2 Aging of Single Emitters and Extrapolation to Bars

5.2.1 Introduction to bar aging

5.2.2 Single-emitter aging as a bar-characterization tool

5.2.3 Influence of temperature and optical power

5.2.4 Influence of stress and mounting: Extrapolation of single-emitter results to bars

5.2.5 Aging signatures of particular defects

5.3 Evaluation of Various Screening Methods for High-Power Laser Bars

5.3.1 Stress measurement and stress impact on reliability

5.3.2 Observation of defects

5.3.3 The by-emitter degradation analysis method

5.3.4 Examples of successful failure prediction

5.4 Conclusion on Best Screening and Failure Prediction Methods

Acknowledgments

References

Chapter 6. Reduction of External Stresses by Improved Packaging Techniques Konstantin Boucke and Christian Scholz

6.1 Design and Fabrication of High-Performance, Expansion-Matched Heat Sinks

6.1.1 Materials selection and basic design rules

6.1.2 Modeling of expansion-matched heat sinks

6.1.3 Fabrication of WCu- and Mo-based expansion-matched heat sinks

6.2 Characterization and Testing of Expansion-Matched Heat Sinks

6.2.1 CTE measurement

6.2.2 Thermal resistance

6.2.3 Flow rate and pressure drop

6.3 Reduction of the Stress Level in Expansion-Matched Packaged Laser Bars

References

Chapter 7. Degradation Modes and Related Defects in High-Power Laser Bars Jens W.Tomm, Juan Jiménez, Myriam Oudart, Julien Nagle, Eric C. Larkins, and Stephen Bull

7.1 Introduction

7.2 Degradation Signatures Occurring in High-Power Laser Bars

7.2.1 Introduction

7.2.2 Overview of severe degradation signatures

7.2.3 Observation of V defects

7.2.4 Observation of facet contamination

7.2.5 Summary: Classification of observed degradation signatures

7.3 Defect Signatures of Degradation Modes

7.3.1 General remarks

7.3.2 Catastrophic degradation

7.3.3 Rapid degradation

7.3.4 Gradual degradation

7.3.5 Summary

7.4 Packaging-Induced Stress and Its Evolution during Device Operation

7.5 The Interplay between Stress and Defects

7.5.1 Overview of microscopic defects observed

7.5.2 Correlation between stresses and defects

7.6 Aging Scenarios

7.6.1 The observation of a strain threshold for device degradation

7.6.2 The thermal runaway model for compressively strained bars

7.6.3 Device degradation during low-frequency pulsed operation

References

Chapter 8. Summary Juan Jiménez and Jens W.Tomm

Appendix. Materials Properties Juan Jiménez, Manuel Avella, Matthieu Pommiés, and Pierre Picouet

Index